Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
Features & Applications
- Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary.
- Outstanding handling characteristics and long pot life at room temperature. No solvents added.
- This product can be screen printed, machine dispensed, stamped, or hand applied.
- Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Sizes Available
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H70E
Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us.
Specifications
Color |
Grey |
Specific Gravity |
1.9 |
Hardness, Shore D |
86 |
Lap shear strength to aluminum, psi |
2000 |
Water Absorption |
0.007 |
Thermal Conductivity, W/mK |
1.0 |
Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
Features & Applications
- Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary.
- Outstanding handling characteristics and long pot life at room temperature. No solvents added.
- This product can be screen printed, machine dispensed, stamped, or hand applied.
- Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Sizes Available
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H70E
Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us.
Specifications
Color |
Grey |
Specific Gravity |
1.9 |
Hardness, Shore D |
86 |
Lap shear strength to aluminum, psi |
2000 |
Water Absorption |
0.007 |
Thermal Conductivity, W/mK |
1.0 |
Original: $50.00
-65%$50.00
$17.50Description
Infinity Bond EP H70E Epoxy Syringes Pre-Mixed and Frozen
Infinity Bond EP H70E is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
Features & Applications
- Heat-sinking adhesive recommended for thermal management applications where good heat dissipation is necessary.
- Outstanding handling characteristics and long pot life at room temperature. No solvents added.
- This product can be screen printed, machine dispensed, stamped, or hand applied.
- Die-attach adhesive designed to be used in the 300C range to resist TC wire bonding operations.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly, excellent material to use for making fast circuit repairs; can be snap-cured for in-line semiconductor die-bonding.
Sizes Available
Pre-mixed syringes: 3cc, 5cc, 10cc, 30cc. Syringes are shipped on dry ice at -80°C.
Alternative to EPO-TEK® H70E
Infinity Bond EP H70E is a direct replacement for EPO-TEK® H70E epoxy adhesive. If you have questions about switching from EPO-TEK® H70E to Infinity Bond EP H70E, don't hesitate to contact us.
Specifications
Color |
Grey |
Specific Gravity |
1.9 |
Hardness, Shore D |
86 |
Lap shear strength to aluminum, psi |
2000 |
Water Absorption |
0.007 |
Thermal Conductivity, W/mK |
1.0 |
